Masatoshi Hasegawa

July 7, 2025

Colorless Polyimides with Low Linear Coefficients of Thermal Expansion and Their Controlled Soft Adhesion/Easy Removability on Glass Substrates: Role of Modified One-Pot Polymerization Method

Abstract This study presents colorless polyimides (PIs) suitable for use as plastic substrates in flexible displays, designed to be compatible…

September 20, 2023

Colorless Polyimides Derived from 5,5′-bis(2,3-norbornanedicarboxylic anhydride): Strategies to Reduce the Linear Coefficients of Thermal Expansion and Improve the Film Toughness

Abstract In this paper, novel colorless polyimides (PIs) derived from 5,5′-bis(2,3-norbornanedicarboxylic anhydride) (BNBDA) were presented. The results of single-crystal X-ray…

March 11, 2022

Solution-Processable Colorless Polyimides Derived from Hydrogenated Pyromellitic Dianhydride: Strategies to Reduce the Coefficients of Thermal Expansion by Maximizing the Spontaneous Chain Orientation Behavior during Solution Casting

Abstract In this study, practically useful colorless polyimides (PIs) with low coefficients of thermal expansion (CTEs) and other desirable properties…

October 18, 2017

Development of Solution-Processable, Optically Transparent Polyimides with Ultra-Low Linear Coefficients of Thermal Expansion

Abstract This paper reviews the development of new high-temperature polymeric materials applicable to plastic substrates in image display devices with…